MCB2103UME 全國供應商、價格、PDF資料

MCB2103UME詳細規(guī)格

類別：通用嵌入式開發(fā)板和套件（MCU、DSP、FPGA、CPLD等）

描述：BOARD EVAL MCB2103 + ULINK-ME

系列：NXP

制造商：Keil

模塊/板類型：

類型：MCU

配套使用產(chǎn)品/相關產(chǎn)品：LPC2101，LPC2102，LPC2103

內(nèi)容：評估板和 Real View MDK-ARM 工具

• GBA24DCBD

  Card Edge, Edgeboard Connectors    Sullins Connector Solutions        CONN EDGECARD 48POS R/A .125 SLD

• GBC43DRXI

  Card Edge, Edgeboard Connectors    Sullins Connector Solutions        CONN EDGECARD 86POS DIP .100 SLD

• MCB2100+U

  過時/停產(chǎn)零件編號    NXP Semiconductors        BOARD EVAL/ULINK JTAG LPC210XARM

• GBM10DCMS

  Card Edge, Edgeboard Connectors    Sullins Connector Solutions        CONN EDGECARD 20POS .156 WW

• MS27467T23B53PA-LC

  圓形 - 外殼    TE Connectivity        CONN HSG PLUG STRGHT 53POS PIN

• MCR03EZPFX8252

  芯片電阻 - 表面安裝    Rohm Semiconductor    0603（1608 公制）    RES 82.5K OHM 1/10W 1% 0603 SMD

• MCR10EZPJ150

  芯片電阻 - 表面安裝    Rohm Semiconductor    0805（2012 公制）    RES 15 OHM 1/8W 5% 0805 SMD

• MCHLC908QT1PE

  嵌入式 - 微控制器，    Freescale Semiconductor    8-DIP（0.300"，7.62mm）    IC MCU 1.5K FLASH 8MHZ 8-DIP

• GBC43DRYS-S734

  Card Edge, Edgeboard Connectors    Sullins Connector Solutions        CONN EDGECARD 86POS DIP .100 SLD

• GBM10DCSI

  Card Edge, Edgeboard Connectors    Sullins Connector Solutions        CONN EDGECARD 20POS DIP .156 SLD

• MS27467T23B53PC-LC

  圓形 - 外殼    TE Connectivity        CONN HSG PLUG STRGHT 53POS PIN

• MCR03EZPFX8253

  芯片電阻 - 表面安裝    Rohm Semiconductor    0603（1608 公制）    RES 825K OHM 1/10W 1% 0603 SMD

• MCR10EZPJ154

  芯片電阻 - 表面安裝    Rohm Semiconductor    0805（2012 公制）    RES 150K OHM 1/8W 5% 0805 SMD

• MCHRC705KJ1CPE

  嵌入式 - 微控制器，    Freescale Semiconductor    16-DIP（0.300"，7.62mm）    IC MCU 1.2K 4MHZ OTP 16-DIP

• GBA24DRST-S288

  Card Edge, Edgeboard Connectors    Sullins Connector Solutions        CONN EDGECARD 48POS .125 EXTEND